Features and Benefits:
· High reliability and low voiding .
· Excellent solderability: solve the poor solder wetting problems of some important Pb-free components, eg. CSP, QFN etc.; Good solderability on various lead-free board / component finishes, including OSP, HASL, ENIG.
· Outstanding printability: long stencil life - 12 hours with continuous and consistently printing.
· Print speeds of up to 150mm/s, enabling a fast print cycle time and a high throughput.
· Wide reflow profile window: reflowable in air or nitrogen, enables high quality solderability of complicated, high density PWB assemblies.
· Excellent solder and flux cosmetics after reflow soldering.
Application
PCB assembly, including smartphone, Tablet PC, motherboards, consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.
Alloy
|
Size
|
Features&Application
|
---|---|---|
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu | Type3(45~25);Type4(38~20) | CSP Excellent wetting properties,Heat resistance |
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu | Type3(45~25);Type4(38~20) | Wide reflow profile window, Tiny pitch for home appliances, vehicle etc |
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu | Type3(45~25);Type4(38~20) | / |
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu | Type3(45~25);Type4(38~20) | Good fluidity,Excellent solderability |
Sn-3Ag-0.5Cu;Sn-1Ag-0.5Cu;Sn-0.3Ag-0.8Cu | Type3(45~25);Type4(38~20) | Highly active product |
42Sn-58Bi;64Sn-1Ag-Bi35;64.7Sn-0.3Ag-Bi35 | Type3(45~25);Type4(38~20) | Low-melting point, high reliability For LED products |